Rennes, Place du Champ-Jacquet
Rennes, Place du Champ-Jacquet
Sokoljan, CC BY-SA 3.0 via Wikimedia Commons

About The SmartICT'23

The second international Conference on Smart Information & Communication Technologies (SmartICT’23) will be held on 24-26 August 2023, in the city of Rennes,France. This conference will include a rich and comprehensive technical program including several sessions.

The objective of SmartICT'23 is to provide an exceptional forum for researchers, PhD students, industrials and policy makers to exchange ideas, techniques and tools, raise awareness, and share experience related to all practical and theoretical aspects of Smart Technologies in: Industry, education, health and society.

Accepted papers, presented at the conference ( online presentations are possible ), will be considered for publication, free of charge for authors, in the open access journal ITM of Web of Conferences. The journal is indexed in various international databases :

  • Submission
  • Registration


(click to fold/unfold)


  • Power Generation & Control
  • Green computing and energy efficiency
  • Energy Conversion & Storage
  • Smart Home and Smart Buildings
  • SCADA and Power System Automation
  • Control System and Automation
  • Smart Grid – Future Electric Grid
  • Photovoltaic Cell & Systems
  • Renewable Energy and Environment Protection
  • Wireless Power Transmission
  • Instrumentation & Measuring Systems
  • RF Devices and Antennas for Wireless Applications
  • Smart Sensors
  • Components, Circuits and Systems
  • Embedded Systems and Applications
  • Robotics and Mechatronics
  • Automotive engineering


  • Industrial Networking
  • System security, privacy, and safety
  • Network Technologies &Wireless Communications
  • Mobile Technologies
  • Manet & Vanet
  • Ultra-wideband and short-range networks
  • Digital Communication
  • Internet of Things
  • Communication Interfaces & Modeling
  • Collaborative Communication Technology
  • Localization and tracking
  • Sensor networks for environmental monitoring (WSN)
  • RFID networks and protocols


  • Social networks and computing
  • Distributed, parallel and HPC systems, Cloud Computing
  • Artificial Intelligence and Machine Learning
  • Image Processing, Computer Vision, & Pattern Recognition
  • Serious Games
  • Signal Detection and Parameter Estimation
  • Health and Medical Informatics
  • Information storage, indexing and retrieval
  • Intelligent Robotics and Multi-agent systems
  • Cryptography, Watermarking and Blockchain
  • Fault Detection & Systems Identification
  • Bioinformatics and Computational Biology
  • Software Engineering and Knowledge Engineering
  • Smart Cities


Authors are welcome to submit their paper to SmartICT'23 through Easychair Platform:

The authors are informed that their paper must fall in one of the topics listed under the tracks.

Each full paper should have minimum 6 to maximum 8 pages including all figures, tables, and references. No extra pages will be accepted.

Before publication, Web of Conferences will randomly check papers using the text comparison tool iThenticate, to prevent plagiarism malpractices.

At least one author of the article should participate in the conference ( online presentations are possible ). To avoid serial publication practices, a maximum of three articles per author can be accepted (regardless of the author's position in the list).

Important dates :

  • Paper Submission Deadline: 4th June 2023 extended to : 11th June 2023
  • Acceptation Notification: 2ndJuly 2023
  • Camera Ready Deadline: 23 July 2023

Submit your paper

Guidelines for the authors

  1. Instructions "how to prepare your article":
  2. Instructions "how to write title and abstract" : here attached
  3. Publication right form (to be signed by at least one of the authors):
  4. Ethical rules :
  5. General editorial guideline :
  6. Templates: the authors must submit their paper in the format of EDP Sciences single column paper template by following all the mentioned guidelines for authors in see the Word Format 17 x 25 cm, one column template.


Title : "Embedded cybersecurity, the cornerstone that enables trust in ICT deployments"
Abstract :

Information & Communication Technologies (ICT) are driving the digitalization of our society and our economy. Recently, issues related to supply chain disruption and the need for more sovereignty have stressed that the security of ICT is getting key.

In this context, secure-by-design approaches are gaining momentum.

In this talk, I'll explain how "roots of trust" are enabling provable security, not only at ICT system inception but also during its complete lifecycle, from chip-to-cloud.

I will present SecuryzrTM, an integrated Secure Element embedding strong technologies, resistant to physical attacks (reverse-engineering, perturbation & side-channel analysis), coupled with the ability to update & upgrade on-the-field.

Besides, I'll illustrate how this offering (iSSP: integrated Security Services Platform) has been certified in terms of cyber-security (Common Criteria, FIPS, IEC 62443, SESIP, etc.) and has been successfully deployed in industrial use-cases.

Biography :

Sylvain Guilley

Co-founder and CTO at Secure-IC

Sylvain Guilley is Co-founder and CTO at Secure-IC, a French company offering security for embedded systems. Secure-IC's flagship product is the multi-certified SecuryzrTM integrated Secure Element (iSE).

Sylvain is lead editor of international standards, such as ISO/IEC 20897 (Physically Unclonable Functions), ISO/IEC 20085 (Calibration of non-invasive testing tools), and ISO/IEC TR 24485 (White Box Cryptography). He is leading the topic “High Level Principles for Design & Architecture'” in the editing team of TR68 (Autonomous Vehicles - Singapore, Standards Development Organisation), and is member of the French BNA (Bureau de Normalisation de l'Automobile).

Besides, Sylvain is associate editor of the Springer Journal of Cryptography Engineering (JCEN). He has co-authored 350+ research papers and filed 40+ invention patents. He is member of the IACR, senior member of the IEEE and the CryptArchi club.

Sylvain is also adjunct professor at Télécom Paris and research associate at Ecole Normale Supérieure (ENS). He is an alumnus from Ecole Polytechnique and Télécom Paris.

Title : "IoSat the Internet of Satellite"
Abstract :

When it comes to evaluating and processing the collected data, the first step is to identify the source of the data. IoSat will make a bold move in the sphere of telecommunications and data apps in order to establish a better strategy for pre-processing and post-processing the given data. The next evolution of how a nanosatellite or CubeSat (or small satellite) will be utilized is to acquire and make decisions for humans from space, managing your data and apps with or without your permission.

Biography :

Mohamed Kayyali

Dr. Kayyali, Certified Innovation Management from Harvard Business School HBS, a PhD & M.Sc from (WCU), he is IEEE Industrial Officer, and BCS (British Computer Society) Chartered Fellow, Chartered Scientist by the Royal Chartered Science Council in UK & Awarded BCS ELITE , his biography listed in Who’s Who in Science and Engineering , he has a patent theory in edge detection with many published journals papers, he is an author of 5 indexed computer science & digital image processing books, listed by the Library of Congress in USA, invited key note speaker by U.N.& EU’s industry Int. conferences ,he was a researcher visitor at the University of California- UCSB @ the image processing labs.

Currently he is:

  1. CEO / co-founder of 4D Business Consulting - (a business advisory firm short listed by European Bank of Reconstruction & Developing,
  2. President of International Federation of Global & Green ICT , USA org. (ITU & IEEE Standardization Partner)
  3. Founder of KSF Space a USA NGO Space Foundation.
  4. Founder of an ISP company in the U.S.A
  5. Founder of Time Business News USA and DNBC.TV an IPTV channel in the USA

Title : "Electronics: sustainability challenges and opportunities of open hardware"
Abstract :

As the hardware support of our digital society, electronics contributes to most of the technological advances in all fields of knowledge. Technological challenges in electronics include energy efficiency, hardware cybersecurity, miniaturization, and dependability. Each solution to these challenges opens up new markets, and creates thousands of new jobs each year.

Globally, the electronics industry produces 53 million tons of waste per year, qualified as e-waste. Less than 20% of this e-waste is recycled, and the trend in annual e-waste production is increasing. The carbon impact of the manufacturing and end-of-life of digital systems is increasingly impacting the carbon footprint of their entire life cycle, alongside the carbon impact of their energy supply. In this context, new methods are needed to increase the repairability, reconfigurability and reusability of systems, as well as to reduce the impacts of the production, usage, and end-of-life of systems.

The ongoing "open source hardware" movement, equivalent to the "open source software" movement of the 2000s, is an opportunity to build sustainable technologies for interoperability and scalability of electronic systems. If these technologies alone will not avoid the rebound effect, they will be an essential tool to achieve the drastic reductions in greenhouse gas emissions and waste necessary to achieve sustainability. The French research and education ESOS project (, 2023-2028) financed by France2030, aims to implement design methods for sustainable electronics, and to train technicians, engineers and doctors capable of implementing this transition.

Biography :

Maxime Pelcat

Maxime Pelcat is an associate professor at INSA Rennes. He conducts his research at the IETR, UMR 6164 of CNRS. He obtained his HDR at the University of Clermont Auvergne in 2017, and his PhD at INSA Rennes in 2010 in collaboration with Texas Instruments.
He is interested in the physical properties of computational systems and is the author of more than 80 publications in the areas of computational models, architecture models, energy efficiency, hardware cybersecurity, and programming of parallel embedded systems. He has been program chair of the SAMOS-IC conference in 2019, general chair of the GDR SOC2 conference in 2020 and general chair of the IEEE SiPS conference in 2022.
Maxime Pelcat is associate editor of the Springer Journal of Signal Processing Systems. He has participated in two H2020 projects, 1 NSF, 1 FUI, and 2 ANR, and is the leader of the ESOS project. Maxime Pelcat was a member of the CNRS national committee, CoNRS section 07 "Information sciences" from 2018 to 2021. He is author of the book "Physical Layer Multi-Core Prototyping" Springer, 2012.


General Chairs

Kidiyo Kpalma, INSA Rennes, France
Sylvain Guégan, INSA Rennes, France

Organizing committee

Ali El Moussati, Mohammed First University, Morocco
Mohamed Emharraf, Mohammed First University, Morocco
Mohammed Ghaouth Belkasmi, Mohammed First University, Morocco
Mohammed Saber, Mohammed First University, Morocco

Technical Program Committee

Abdelhafid BESSAID, University of Tlemcen, Algeria
Amadou MAIGA, Gaston Berger University, Saint-Louis, Senegal
Amel BENAZZA, University of Carthage, Tunisia
Balasubramanian RAMAN, Indian Institute of Technology Roorkee, India
Camille Edié N'ZI, Felix Houphouet-Boigny National Polytechnic Institute, Yamoussoukro, Ivory Coast
Catherine SOLADIÉ, CentraleSupélec - Rennes Campus, France
Cong BAI, Zhejiang University of Technology, Hangzhou, China
Denis HAMAD, Université du Littoral Côte d’Opale, France
Driss IZBAIM, Ibn Zohr University, Agadir, Morocco
Ghaïs ELZEIN, National Institutes of Science and Technology, INSA Rennes, France
Gheorghe ZAHARIA, National Institutes of Science and Technology, INSA Rennes, France
Joseph RONSIN, National Institutes of Science and Technology, INSA Rennes, France
Khaly TALL, Cheikh Anta Diop University, Dakar, Senegal
Kiril ANGUELOV, Technical university of Sofia, Bulgaria
Lahoucine EL MAIMOUNI, Polydisciplinary Faculty of Ouarzazate, Morocco
Lamine NDIAYE, Cheikh Anta Diop University, Dakar, Senegal
Meriem OUTTAS, National Institutes of Science and Technology, INSA Rennes, France
Moctar MOSSI IDRISSA, Abdou Moumouni University, Niamey, Niger
Mohamed DAOUDI, University of Lille, France
Mohamed EL BAHRI, Djillali Liabes University of Sidi Bel Abbes, Algeria
Mohamed KAYYALI, CEO of 4D Business Consulting, Morocco
Nasreddine TALEB, Djillali Liabes University of Sidi Bel Abbes, Algeria
Oumar DIOP, Gaston Berger University, Saint-Louis, Senegal
Qiong WANG, Zhejiang University of Technology, Hangzhou, China
Raphael GILLARD, National Institutes of Science and Technology, INSA Rennes, France
Renaud SÉGUIER, CentraleSupélec - Rennes Campus, France
Roumi KOUNTCHEVA, TK Engineering, Sofia, Bulgaria
Sylvain GUILLEY, Telecom Paris, France
Taoufiq BELHOUSSINE DRISSI, Ain-Chock Faculty of Sciences, Casablanca, Morocco
Weizhi LU, Shandong University, Jinan, China
Wenbin ZOU, Shenzhen University, Shenzhen, Guangdong, China
Yong ZHAO, Peking University, Shenzhen, China
Youcef BENTOUTOU, Agence spatiale algérienne, Algeria

(more will be added ...)


Registration Fees :

Category Early Bird :
before August 6th
After August 6th
(up to August 17th)
Students 200.00 € 250.00 €
Others 250.00 € 300.00 €

Including lunches (24th and 25th) and gala

Payment of registration fees(to be defined ...)

Social event : visit to Mont Saint Michel (to be defined ...)

Mont Saint-Michel
Mont Saint-Michel
Amaustan, CC BY-SA 4.0 via Wikimedia Commons


(to be defined ...)



INSA, Rennes, France

Rennes, Hotel de ville
Rennes, Hotel de ville
Édouard Hue, CC BY-SA 3.0 via Wikimedia Commons